Compute, memory, storage, and connectivity demands are forcing the industry to adapt as it meets the expanding needs of cloud, edge, enterprise, 5G, and high-performance computing. UCIe — Universal Chiplet Interconnect Express — is an open industry standard founded by the leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers to address customer requests for more customizable package-level integration. The organization is also fostering an open chiplet ecosystem by offering high-bandwidth, low-latency, power-efficient, and cost-effective on-package connectivity between chiplets. The UCIe 1.0 specification provides a fully defined stack that comprehends plug-and-play interoperability of chiplets on a package — similar to the seamless interplay on board with off-package interconnect standards such PCI Express®, Universal Serial Bus (USB)®, and Compute Express Link™ (CXL™). This presentation explores the industry demand that brought about the UCIe specification and shares how end-users can easily mix and match chiplet components provided by a multi-vendor ecosystem for System-on-Chip (SoC) construction, including customized SoC.
Universal Chiplet Express: Accelerating the future of semiconductor innovations in an open source environment
For the past three decades, PCI-SIG® has delivered a succession of industry-leading PCI Express® (PCIe®) specifications that remain ahead of the increasing demand for a high-bandwidth, low-latency
We present RAINBLOCK, a public blockchain that achieves high transaction throughput without modifying the proof-of-work consensus.
AI/ML is not new, but innovations in ML models development have made it possible to process data at unprecedented speeds.
Modern AI systems usually require diverse data processing and feature engineering at a tremendous scale and employ heavy and complex deep learning model that requires expensive accelerators or GPUs
The next generation of automobiles moves to the adoption of PCIe for data communications in vehicles, and the JEDEC Automotive SSD solution enables a high performance, high reliability solution for
In this session I will start with identifying the current problems in Artificial Intelligence as data exists in most industries/edge in the form of isolated pockets with privacy constraints for sha
SNIA Developer Conference
September 16-18, 2024
SDC 2024 is brought to you by SNIA. SNIA is an industry association committed to its mission of worldwide leadership developing and promoting architectures, standards, education and vendor-neutral collaboration.
